JPS62133774A - フオトセンサ - Google Patents

フオトセンサ

Info

Publication number
JPS62133774A
JPS62133774A JP60273753A JP27375385A JPS62133774A JP S62133774 A JPS62133774 A JP S62133774A JP 60273753 A JP60273753 A JP 60273753A JP 27375385 A JP27375385 A JP 27375385A JP S62133774 A JPS62133774 A JP S62133774A
Authority
JP
Japan
Prior art keywords
light
holder
lead frame
photosensor
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60273753A
Other languages
English (en)
Japanese (ja)
Other versions
JPH057874B2 (en]
Inventor
Hirofumi Shindo
弘文 進藤
Yasushi Hasegawa
也寸志 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP60273753A priority Critical patent/JPS62133774A/ja
Publication of JPS62133774A publication Critical patent/JPS62133774A/ja
Publication of JPH057874B2 publication Critical patent/JPH057874B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Geophysics And Detection Of Objects (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP60273753A 1985-12-05 1985-12-05 フオトセンサ Granted JPS62133774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60273753A JPS62133774A (ja) 1985-12-05 1985-12-05 フオトセンサ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60273753A JPS62133774A (ja) 1985-12-05 1985-12-05 フオトセンサ

Publications (2)

Publication Number Publication Date
JPS62133774A true JPS62133774A (ja) 1987-06-16
JPH057874B2 JPH057874B2 (en]) 1993-01-29

Family

ID=17532095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60273753A Granted JPS62133774A (ja) 1985-12-05 1985-12-05 フオトセンサ

Country Status (1)

Country Link
JP (1) JPS62133774A (en])

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101556U (en]) * 1989-01-27 1990-08-13
US5291038A (en) * 1990-12-19 1994-03-01 Sharp Kabushiki Kaisha Reflective type photointerrupter
JP2009041279A (ja) * 2007-08-09 2009-02-26 Panasonic Electric Works Co Ltd オーバーフロー口の開閉構造
US7764271B2 (en) 2005-09-13 2010-07-27 Lite-On Technology Corp. Method of manufacturing an optical module
JP2012195502A (ja) * 2011-03-17 2012-10-11 Yazaki Corp モジュールの端子構造

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02101556U (en]) * 1989-01-27 1990-08-13
US5291038A (en) * 1990-12-19 1994-03-01 Sharp Kabushiki Kaisha Reflective type photointerrupter
US7764271B2 (en) 2005-09-13 2010-07-27 Lite-On Technology Corp. Method of manufacturing an optical module
JP2009041279A (ja) * 2007-08-09 2009-02-26 Panasonic Electric Works Co Ltd オーバーフロー口の開閉構造
JP2012195502A (ja) * 2011-03-17 2012-10-11 Yazaki Corp モジュールの端子構造

Also Published As

Publication number Publication date
JPH057874B2 (en]) 1993-01-29

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term